E-paper edge bonding adhesive is a one component, heat curing non-conductive epoxy adhesive. It has good long-term water resistance, and its rheological property is suitable for high-speed display flow production This product is specially designed for the edge sealing of e-books and electronic labels. The product can be quickly solidified at 70-80 ℃, with low shrinkage and excellent adhesion to glass substrate; It has excellent water vapor resistance, and can pass severe tests such as high temperature and high humidity, high temperature and low humidity, thermal shock, etc。